Packaging Engineer
Job Summary
We are recruiting a Photonics Packaging Engineer to join an innovative, advanced-technology company developing next-generation optoelectronic solutions. The successful candidate will play a key technical role in developing robust assembly and packaging processes that support scalable, high-performance optical products. This position offers the opportunity to work on cutting-edge photonic integrated module technologies in a highly collaborative engineering environment.
Responsibilities
- Develop and maintain optoelectronic assembly processes
- Optimize alignment, thermal reliability, and yield
- Design optical alignment and fibre attachment methods
- Perform optical and electrical module characterisation
Required Skills
- Degree in Engineering, Physics, or Materials Science
- 5+ years in photonic/semiconductor packaging
- Experience with Flip-chip, wire bonding, or alignment
- Optical and electrical characterisation skills
Job Details
Key Responsibilities:
- Develop, refine, and maintain assembly processes for advanced optoelectronic modules.
- Support packaging activities involving photonic and electronic components such as lasers, photonic integrated circuits, and detectors.
- Drive process optimisation focused on alignment precision, thermal-mechanical reliability, manufacturability, and production yield.
- Design and implement optical alignment and fibre attachment methods, including passive and active alignment techniques.
- Conduct optical and electrical performance evaluation of packaged modules, including insertion loss, back reflection, and functional verification.
Required Experience & Qualifications:
- Degree in Electrical Engineering, Photonics, Physics, Materials Science, Mechanical Engineering, or a related technical discipline.
- 5+ years of hands-on experience in photonic, optoelectronic, semiconductor, or advanced electronics packaging environments.
- Experience with either Flip-chip assembly, wire or ribbon bonding, or Optical alignment.
- Experience performing optical and electrical characterisation at the module or subsystem level.
Benefits:
- Full benefits packages – Pension, holiday allowance, etc.
- Work on advanced semiconductor technologies